The corresponding needs for I/O on these devices have compelled the manufacturers to utilize high-density ball grid array (BGA) packages, now with configurations exceeding 1,000 pins with very narrow ...
Traditionally, multi-chip module (MCM) flip chip ball grid array (FCBGA ... for heterogeneous integration with a high-density interposer. The S-SWIFT methodology addresses several critical design ...
From automated magnetic components to grid-connected inverters ... “High Fidelity Modeling based High Power Density Three Phase Coupled Inductor Design for EV Applications,” Shahid Aziz ...
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