Cadence Spectre X Simulator accelerated by 10X and 3D-IC design and analysis (thermal, stress, and warpage) accelerated by 7X. These improvements not only speed up the development process but also ...

The integration has bolstered computational speedups, including computational fluid dynamics (CFD) simulations reduced by up to 80X, Cadence Spectre X Simulator accelerated by 10X and 3D-IC design ...

Lam Research benefits from the rise in AI-driven chip demand. Read why LRCX stock is a solid buy for long-term investors despite near-term economic concerns.

Moreover, after the acquisition of Gen3D, the company has incorporated its Sulis Flow and Sulis Lattice ... The key features of this integration include 3D-IC Design, which will enable real ...

In [33], they implemented two tiers logic of 2.5 mm x 5 mm with a three layer 8-channel 3D DRAM stacked on top using Tezzaron 3D technology with Global Foundaries 130 nm process 1.5 V. The purpose is ...

D sensing—now widely used in autonomous driving, AR/VR, healthcare, industrial automation, robotics, and surveillance—employs depth sensing as a major building block to facilitate real-time object ...

Capturing precise 3D details with a single camera has long been a challenge. Traditional methods often require complex ...