One of the sources briefed on the unit’s efforts said that HiSilicon had shipped some low-end surveillance chips since 2019 but that its focus was on the high-end arena and reclaiming market ...
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Huawei’s Pura 70 smartphone contains new 7-nm HiSilicon chip made by top Chinese foundry SMIC, report saysThe Pura 70's system-on-a-chip was identified as the Kirin 9010 processor manufactured by SMIC using its 7-nm N+2 node, according to TechInsights The new phone is a sign that Huawei could have ...
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Huawei preps new Kunpeng CPU with HBM — unannounced Kunpeng Arm server chip matches Intel and AMD's techNew e-mails from Huawei engineers regarding Linux kernel development suggest that HiSilicon - Huawei's chip subsidiary - is prepping a new Kunpeng SoC with HBM (High Bandwidth Memory) technology ...
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One of 2024’s most unique folding phones may be getting a successorThe Huawei Mate XT was one of 2024's most unique folding phones. Now, it looks like a successor is already in the works.
Top-10 semiconductor suppliers logged strong 17% jump in 1H20/1H19 sales. August 12, 2020 -- IC Insights will release its August Update to the 2020 McClean Report later this month. This Update ...
SAN JOSE, Calif. -- Nov 6, 2017-- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence ® Tensilica ...
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